Description

PCB plating may be defined as one or both of the following: Via plating – the process of filling a drilled hole with copper to provide a path for current from a surface of the board to an inner layer, between two inner layers or from one surface to the other. These plated through holes (PTHs) are better known as vias.

In the PCB manufacturing process, electroless copper plating is an important step. It is widely used in the following two processes. One is plating onto bare laminate and the other is plating through hole, because under these two circumstances, electroplating cannot or can hardly be carried out. In the process of plating onto bare laminate, electroless copper plating plates a thin layer of copper on the bare substrate to make the substrate conductive for further electroplating. In the process of plating through hole, electroless copper plating is used to make the inner walls of the hole conductive to connect the printed circuits in different layers or the pins of the integrated chips.

When through hole used dc plating, the thicker the plating around the hole is, and there is no plating in the hole. The two ends are big and the middle is small. This dog bone phenomenon is prone to copper cracking, or no electricity at all.

Positive and negative pulse power supply can increase electroplating speed. Improve the uniformity of copper plating, deep hole plating uniformity; Reverse pulse electroplating can control the deposition rate of copper in the high current density area, so as to improve the thickness uniformity of surface copper and pore copper, and eliminate the “dog bone” phenomenon.

Pulse Waveform

Analog waveform of normal positive and negative pulse output

Normal positive and negative pulse output actual waveform diagram

Combined pulse output analog waveform diagram

Combined pulse output actual waveform diagram

Technical Parameters

Optional models

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